949588 \ features ? glass passivated junction hermetically sealed package applications high voltage rectification efficiency diode in horizontal deflection circuits mechanical data case: sintered glass case, sod 64 terminals: plated axial leads, solderable per mil-std-750, method 2026 polarity: color band denotes cathode end mounting position: any weight: 860 mg, (max. 1000 mg) parts table absolute maximum ratings t amb = 25 c, unless otherwise specified maximum thermal resistance t amb = 25 c, unless otherwise specified part type differentiation package BY228 v r = 1500 v; i fav = 3 a sod64 parameter te s t c o n d i t i o n sub type symbol value unit reverse voltage see electrical characteristics v r 1500 v repetitive peak reverse voltage i r = 100 a v rrm 1650 v peak forward surge current t p = 10 ms, half sinewave i fsm 50 a average forward current i fav 3 a junction temperature t j 140 c storage temperature range t stg - 55 to + 175 c non repetitive reverse avalanche energy i (br)r = 0.4 a e r 10 mj parameter test condition sub type symbol value unit junction ambient on pc board with spacing 25 mm r thja 70 k/w BY228 standard avalanche sinterglass diode http://www.luguang.cn mail:lge@luguang.cn
electrical characteristics t amb = 25 c, unless otherwise specified typical characteristics (t amb = 25 c unless otherwise specified) parameter test condition sub type symbol min ty p. max unit forward voltage i f = 5 a v f 1.5 v reverse current v r = 1500 v i r 2 5 a v r = 1500 v, t j = 140 c i r 140 a total reverse recovery time i f = 1 a, - di f /dt = 0.05 a/ s t rr 20 s reverse recovery time i f = 0.5 a, i r = 1 a, i r = 0,25 a t rr 2 s figure 1. typ. thermal resistance vs. lead length figure 2. forward current vs. forward voltage 0 5 10 15 25 0 10 20 30 40 r ? therm. resist. junction / ambient ( k/w ) thja l ? lead length ( mm ) 30 94 9081 20 ll t l =constant i ? forward current ( a) 0.001 0.010 0.100 1.000 10.000 100.000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 v f ? forward voltage ( v ) 16407 f t j =25 c t j =150 c figure 3. max. average forward current vs. ambient temperature figure 4. reverse current vs. junction temperature 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 t amb ? ambient temperature ( c ) 16408 i ? average forward current ( a ) fav v r =v rrm half sinewave r thja =25k/w l=10mm r thja =70k/w pcb: d=25mm 1 10 100 1000 25 50 75 100 125 150 t j ? junction temperature ( c ) 16409 v r = v rrm i ? reverse current ( a ) r BY228 standard avalanche sinterglass diode http://www.luguang.cn mail:lge@luguang.cn
package dimensions in mm figure 5. max. reverse power dissipation vs. junction temperature 0 50 100 150 200 250 300 350 25 50 75 100 125 150 t j ? junction temperature ( c ) 16410 v r = v rrm p ? reverse power dissipation ( mw ) r p r ?limit @100%v r p r ?limit @80%v r figure 6. diode capacitance vs. reverse voltage 0 10 20 30 40 50 60 70 0.1 1.0 10.0 100.0 v r ? reverse voltage ( v ) 16411 c ? diode capacitance ( pf ) d f=1mhz cathode identification ? 4.3 max. ? 1.35 max. 4.2 max. sintered glass case sod 64 weight max. 1.0g technical drawings according to din specifications 94 9587 26 min. 26 min. BY228 standard avalanche sinterglass diode http://www.luguang.cn mail:lge@luguang.cn
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